Two flip-chip integrated circuits surrounded by surface mount passive components. Should put a heat sink on those though, bare die chips don’t thermal throttle as effectively because they don’t have heat spreaders, and can be damaged by their own heat.
Two flip-chip integrated circuits surrounded by surface mount passive components. Should put a heat sink on those though, bare die chips don’t thermal throttle as effectively because they don’t have heat spreaders, and can be damaged by their own heat.