The transfer speed isn’t the big issue, it’s the density and reliability. Packing more heat generating stuff onto the SoC package just makes it more difficult to dissipate. The transfer of data to where it needs to be is still the same, so the trade-off is pretty null in that sense except reduction of overall power consumption.
The transfer speed isn’t the big issue, it’s the density and reliability. Packing more heat generating stuff onto the SoC package just makes it more difficult to dissipate. The transfer of data to where it needs to be is still the same, so the trade-off is pretty null in that sense except reduction of overall power consumption.